Printed Circuit Board (PCB) Assembly Market Size & Share,
Trends, Analysis – 2032

Global Printed Circuit Board PCB Assembly Market will depict
over 5% CAGR from 2024 to 2032, catapulted by the globalization of electronics
manufacturing. Manufacturers are increasingly moving production to regions like
Asia-Pacific to capitalize on cost-effective production hubs. This trend is
driven by factors such as lower labor costs, supportive regulatory
environments, and proximity to key markets.

In 2023, fixed-asset investment in China's electronic
information manufacturing industry increased by 9.3% year on year, surpassing
the overall industry growth by 0.3 percentage points, according to the Ministry
of Industry and Information Technology. The industrial added value rose by
3.4%, with a December increase of 9.6% compared to December 2022. Mobile phone
production grew by 6.9% to 1.57 billion units, including a 1.9% rise in
smartphone output to 1.14 billion units.

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This shift not only enhances manufacturing efficiency but
also facilitates access to a skilled workforce and advanced technologies. The
PCB assembly market benefits from expanded production capacities and
streamlined supply chains, supporting the growing demand for electronics across
various industries worldwide.

The overall printed circuit board PCB assembly market is
segmented based on the type of PCB, component, technology, soldering process,
volume, assembly, vertical, and region.

The ball grid array segment will register a remarkable CAGR
during 2024-2032. The demand for Printed Circuit Board PCB Assembly is rising
significantly within the ball grid array BGA assembly segment due to its
advantages in enhancing electronic device performance and reliability. As
electronic devices become compact and powerful, there is a growing demand for
PCB assemblies that can accommodate these requirements without compromising on
functionality or durability. This trend is propelled by innovations in ball
grid array technology, making it a preferred choice for a wide range of
applications across industries.

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The flexible PCB sector will garner a noticeable printed
circuit board PCB assembly market share by 203, owing to its ability to meet
the needs of modern electronic devices that require flexibility, lightweight
design, and space-saving solutions. Flexible PCBs offer advantages such as
bendability, reduced weight, and enhanced durability compared to rigid PCBs.
They are essential for applications in wearable technology, foldable
smartphones, and automotive electronics where compact and adaptable designs are
crucial. This trend is escalated by advancements in materials and manufacturing
processes that enable the production of high-performance flexible PCB
assemblies tailored to diverse industry demands.

The CAGR for the North America printed circuit board PCB
assembly market will be promising during the 2024 to 2032 timeframe. These
include a robust expansion in industries such as aerospace, defense,
automotive, and healthcare, all of which heavily rely on advanced electronics.
In addition, increasing investments in research and development foster
innovation in PCB technologies, amplifying demand. Strict regulatory standards
for electronics reliability and safety contribute to the adoption of high-quality
PCB assemblies. This combination of factors positions North America as a
significant market, thrusting its continued growth and adaptation to evolving
industry needs.

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