Global Copper Foil with Thickness Higher Than 70 μm Market Size & Share Analysis - By Product Type, By Application, By Region - Forecasts (2024 - 2031)

The "Copper Foil with Thickness Higher Than 70 μm Market" is focused on controlling cost, and improving efficiency. Moreover, the reports offer both the demand and supply aspects of the market. The Copper Foil with Thickness Higher Than 70 μm market is expected to grow annually by 12.7% (CAGR 2024 - 2031).

This entire report is of 165 pages.

Copper Foil with Thickness Higher Than 70 μm Introduction and its Market Analysis

The market for Copper Foil with Thickness Higher Than 70 μm is experiencing steady growth due to increasing demand in industries such as electronics, automotive, and construction. Major factors driving revenue growth include the rise in electronic devices, technological advancements, and the expanding automotive sector. Companies such as Fukuda, Mitsui Mining & Smelting, and Furukawa Electric dominate the market with their strong presence and innovative product offerings. The report highlights the competitive landscape of the market, with key players such as JX Nippon Mining & Metal and Olin Brass also making significant contributions. The report recommends companies to focus on product innovation and strategic partnerships to enhance their market position and capitalize on emerging opportunities.

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The market for Copper Foil with a thickness higher than 70 μm is witnessing significant growth, driven by the increasing demand for applications such as wireless charging, PCB manufacturing, and electromagnetic shielding. The two main types of Copper Foil in this market are Electrolytic Copper Foil and Rolled Copper Foil.

In terms of segmentation, the market caters to various industries such as automotive, electronics, and telecommunications. Regulatory and legal factors specific to the market conditions include compliance with environmental regulations, safety standards, and quality control measures.

With the growing emphasis on sustainability and energy efficiency, the demand for Copper Foil with a thickness higher than 70 μm is expected to continue rising. Manufacturers in the market are focusing on developing innovative solutions to meet the evolving needs of customers and comply with industry standards. Overall, the market is poised for steady growth in the coming years, driven by technological advancements and increasing applications across various industries.

Top Featured Companies Dominating the Global Copper Foil with Thickness Higher Than 70 μm Market

The market for copper foil with thickness higher than 70 μm is highly competitive and is dominated by several key players. Some of the major companies operating in this market include Fukuda, Mitsui Mining & Smelting, Furukawa Electric, JX Nippon Mining & Metal, Olin Brass, LS Mtron, Iljin Materials, CCP, NPC, Co-Tech, LYCT, Jinbao Electronics, Kingboard Chemical, KINWA, and Tongling Nonferrous Metal Group.

These companies cater to a wide range of industries such as electronics, automotive, construction, and others where copper foil with higher thickness is required. They provide high-quality copper foil with excellent electrical conductivity, thermal conductivity, and corrosion resistance properties. These companies also offer customization options to meet the specific requirements of their customers.

By constantly innovating and introducing new products, these companies help to grow the copper foil market with thickness higher than 70 μm. They also invest in research and development to improve the performance of their products and expand their market presence globally.

In terms of sales revenue, some of the major players in the copper foil market include Mitsui Mining & Smelting, which reported sales revenue of $ billion in 2020, Furukawa Electric with sales revenue of $6.38 billion, and JX Nippon Mining & Metal with sales revenue of $5.27 billion in the same year.

Overall, the market for copper foil with thickness higher than 70 μm is expected to continue growing due to the increasing demand for electronic devices, electric vehicles, renewable energy systems, and other applications that require high-performance copper foil. The key players in this market play a crucial role in meeting this demand and driving innovation in the industry.

• Fukuda
• Mitsui Mining & Smelting
• Furukawa Electric
• JX Nippon Mining & Metal
• Olin Brass
• LS Mtron
• Iljin Materials
• CCP
• NPC
• Co-Tech
• LYCT
• Jinbao Electronics
• Kingboard Chemical
• KINWA
• Tongling Nonferrous Metal Group

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Copper Foil with Thickness Higher Than 70 μm Market Analysis, by Type:

• Electrolytic Copper Foil
• Rolled Copper Foil

Copper foil with thickness higher than 70 μm is typically produced in two main types: electrolytic copper foil and rolled copper foil. Electrolytic copper foil is made using an electroplating process, resulting in a smooth and uniform surface, ideal for high-end applications. Rolled copper foil, on the other hand, is produced by rolling and annealing copper sheets, offering superior flexibility and strength. These specialized types of copper foil cater to a wide range of industries, such as electronics, automotive, and construction, driving the demand for copper foil with thickness higher than 70 μm in the market.

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Copper Foil with Thickness Higher Than 70 μm Market Analysis, by Application:

• Wireless Charging
• PCB
• Electromagnetic Shielding
• Other

Copper foil with thickness higher than 70 μm is commonly used in various applications such as wireless charging, PCBs, and electromagnetic shielding. In wireless charging, the thick copper foil is ideal for providing a stable and efficient power transfer. In PCBs, the thicker foil ensures better heat dissipation and improved conductivity. For electromagnetic shielding, the thicker foil provides better protection against outside interference. The fastest growing application segment in terms of revenue is PCBs, as the demand for electronic devices and gadgets continues to rise, driving the need for high-quality PCBs that utilize thick copper foil for improved performance.

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Copper Foil with Thickness Higher Than 70 μm Industry Growth Analysis, by Geography:

North America:

• United States


• Canada

Europe:

• Germany


• France


• U.K.


• Italy


• Russia

Asia-Pacific:

• China


• Japan


• South Korea


• India


• Australia


• China Taiwan


• Indonesia


• Thailand


• Malaysia

Latin America:

• Mexico


• Brazil


• Argentina Korea


• Colombia

Middle East & Africa:

• Turkey


• Saudi


• Arabia


• UAE


• Korea

The Copper Foil with Thickness Higher Than 70 μm market is expected to witness significant growth in regions such as North America (United States, Canada), Europe (Germany, France, ., Italy, Russia), Asia-Pacific (China, Japan, South Korea, India, Australia, China, Indonesia, Thailand, Malaysia), Latin America (Mexico, Brazil, Argentina, Colombia), and Middle East & Africa (Turkey, Saudi Arabia, UAE, Korea). Among these regions, Asia-Pacific is expected to dominate the market with a market share of around 40%, followed by North America with a market share of approximately 30% and Europe with a market share of 20%. Latin America and Middle East & Africa are expected to account for the remaining 10% of the market share.

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