Multi-beam Mask Writer Research:CAGR of 13.8% during the forecast period
QY Research Inc. (Global Market Report Research Publisher) announces the release of 2025 latest report “Multi-beam Mask Writer- Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031”. Based on current situation and impact historical analysis (2020-2024) and forecast calculations (2025-2031), this report provides a comprehensive analysis of the global Wire Drawing Dies market, including market size, share, demand, industry development status, and forecasts for the next few years.
The global market for Multi-beam Mask Writer was estimated to be worth US$ 960 million in 2024 and is forecast to a readjusted size of US$ 2084 million by 2031 with a CAGR of 11.9% during the forecast period 2025-2031.
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Multi-beam Mask Writer Market Summary
Mask writers are devices that use irradiation by electron beams to draw a fine electronic circuit pattern onto a template (the mask), which has been formed by a silica glass substrate with photosensitive resin.
Single-beam mask writers write data to the mask by concentrating the single electron beam on a single position over an electromagnetic field and then deflecting the beam to the position to be irradiated by the polarizer. Large circuit patterns can be created by repeating beam deflection and then moving the stage upon which the substrate is mounted. Using thousands of tiny beamlets, multi-beam mask writers can pattern or write advanced masks at a faster rate compared to VSB-based tools. With chip miniaturization making device designs more complex and requiring the use of more masks, multibeam systems are coming into demand.
Multi-beam mask writers can be categorized by production node into 7nm and above, 5nm, and 3nm and below. The 7nm and above category is used for consumer electronics such as high-performance computing devices like smartphones, tablets, and laptops, as well as data center servers and networking equipment. It is also applied in automotive systems like ADAS and infotainment systems, and in IoT devices such as smart home devices and connected sensors. The 5nm category is designed for high-performance computing (HPC) tasks, including AI and machine learning, flagship smartphone processors, and high-performance networking equipment. The 3nm and below category targets ultra-high-performance chips for next-generation consumer electronics, such as advanced smartphones and portable devices, and advanced HPC applications like next-generation data centers, supercomputers, and AI accelerators. It also supports emerging technologies in quantum computing and advanced AI systems. TSMC is expected to install and begin production of its 2nm lithography machine in 2025.
Multi-beam mask writer market can be segmented by application into wafer manufacturers and EUV mask manufacturers. Leading wafer manufacturers such as TSMC and Samsung typically produce their own photomasks to meet the demands of advanced process nodes. EUV mask manufacturers include prominent commercial photomask suppliers like Photronics and DNP, which require multi-beam mask writers to produce high-precision EUV masks. As chip manufacturing technology advances, the demand for EUV masks continues to grow, driving the expansion of the multi-beam mask writer market. The growth of the EUV mask market is primarily driven by the rapid development of the semiconductor industry, particularly in advanced process nodes where EUV masks are essential.
According to the new market research report “Global Multi-beam Mask Writer Market Report 2025-2031”, published by QYResearch, the global Multi-beam Mask Writer market size is projected to reach USD 2.17 billion by 2031, at a CAGR of 13.8% during the forecast period.
Figure00001. Global Multi-beam Mask Writer Market Size (US$ Million), 2020-2031
Above data is based on report from QYResearch Semiconductor Research Center: Global Multi-beam Mask Writer Market Report 2025-2031 (published in 2025). If you need the latest data, plaese contact QYResearch.
The growth of the multi-beam mask writer market is driven by several key factors. First, the increasing demand for advanced semiconductor devices in industries such as consumer electronics, automotive, telecommunications, and healthcare is driving the market for multi-beam mask writers, as these tools are essential for creating high-precision photomasks. Second, the trend toward smaller semiconductor node sizes, such as 5nm, 3nm, and beyond, has made multi-beam mask writers indispensable due to their ability to write masks faster and more precisely compared to traditional single-beam systems. Additionally, the rapid adoption of artificial intelligence (AI), the Internet of Things (IoT), and 5G technologies is fueling the need for high-performance chips, which in turn boosts the demand for efficient and high-performance mask writing systems. Finally, as chip designs become more complex, multi-beam mask writers provide the precision and throughput needed to effectively handle these intricate designs.
Figure00002. Global Multi-beam Mask Writer Top 2 Players Ranking and Market Share (Ranking is based on the revenue of 2024, continually updated)
Above data is based on report from QYResearch Semiconductor Research Center: Global Multi-beam Mask Writer Market Report 2025-2031 (published in 2025). If you need the latest data, plaese contact QYResearch.
According to QYResearch, the global main manufacturers of multi-beam mask writer include IMS Nanofabrication and NuFlare Technology. IMS Nanofabrication develop and produce the world’s first multi-beam mask writers for the global semiconductor industry. IMS Nanofabrication hold a revenue share of 81.52% in 2024.
The multi-beam mask writer industry faces numerous opportunities for development. With the continuous advancement of semiconductor technology, especially the widespread application of extreme ultraviolet lithography (EUV) technology, the demand for high-precision masks continues to grow. Leading wafer manufacturers such as TSMC and Samsung typically produce their own photomasks to meet the demands of advanced process nodes. Additionally, the growth of the EUV mask market is primarily driven by the rapid development of the semiconductor industry, particularly in the application of advanced process nodes, where EUV masks have become an essential key material. As chip manufacturing technology advances, the demand for EUV masks continues to grow, driving the expansion of the multi-beam mask writer market. Furthermore, technological progress and the impetus of emerging technologies have brought new opportunities to the industry, making multi-beam mask writers more competitive in the high-end market.
However, the multi-beam mask writer industry also faces several challenges. Firstly, there are high market entry barriers, with new entrants needing to overcome the obstacles of technical complexity and high costs. Secondly, price fluctuations and changes in supply and demand increase market uncertainty. High-performance products are priced higher, but this also means greater room for profit margin adjustment, leading to significant price fluctuations in the high-end market. Additionally, geopolitical situations and exchange rate fluctuations increase export risks, prompting some companies to accelerate the transfer of production capacity. The increasingly strict environmental regulations also bring transformation pressure to small and medium-sized enterprises. Finally, as chip designs become increasingly complex, multi-beam mask writers need to continuously innovate to meet higher precision and efficiency requirements.
Traditional e-beam lithography systems are increasingly struggling to meet the demands of smaller nodes due to limitations in writing speed and resolution. MBMWs offer a solution by using multiple beams simultaneously, significantly improving throughput and enabling finer patterning. Major semiconductor foundries and IDMs are key customers for MBMWs as they push the boundaries of Moore's Law. These companies are investing in advanced lithography tools to maintain competitiveness in the market.
The report provides a detailed analysis of the market size, growth potential, and key trends for each segment. Through detailed analysis, industry players can identify profit opportunities, develop strategies for specific customer segments, and allocate resources effectively.
The Multi-beam Mask Writer market is segmented as below:
By Company
IMS Nanofabrication
NuFlare Technology
Segment by Type
7nm and Above
5nm
3nm and Below
Segment by Application
Wafer Manufacturer
EUV Mask Manufacturer
Each chapter of the report provides detailed information for readers to further understand the Multi-beam Mask Writer market:
Chapter 1: Introduces the report scope of the Multi-beam Mask Writer report, global total market size (valve, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry. (2020-2031)
Chapter 2: Detailed analysis of Multi-beam Mask Writer manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc. (2020-2025)
Chapter 3: Provides the analysis of various Multi-beam Mask Writer market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments. (2020-2031)
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.(2020-2031)
Chapter 5: Sales, revenue of Multi-beam Mask Writer in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world..(2020-2031)
Chapter 6: Sales, revenue of Multi-beam Mask Writer in country level. It provides sigmate data by Type, and by Application for each country/region.(2020-2031)
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc. (2020-2025)
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.
Benefits of purchasing QYResearch report:
Competitive Analysis: QYResearch provides in-depth Multi-beam Mask Writer competitive analysis, including information on key company profiles, new entrants, acquisitions, mergers, large market shear, opportunities, and challenges. These analyses provide clients with a comprehensive understanding of market conditions and competitive dynamics, enabling them to develop effective market strategies and maintain their competitive edge.
Industry Analysis: QYResearch provides Multi-beam Mask Writer comprehensive industry data and trend analysis, including raw material analysis, market application analysis, product type analysis, market demand analysis, market supply analysis, downstream market analysis, and supply chain analysis.
and trend analysis. These analyses help clients understand the direction of industry development and make informed business decisions.
Market Size: QYResearch provides Multi-beam Mask Writer market size analysis, including capacity, production, sales, production value, price, cost, and profit analysis. This data helps clients understand market size and development potential, and is an important reference for business development.
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