Silver Sintering Die Attach Machine Analysis Report ：the market size is projected to reach USD 0.2 billion by 2031

A Silver Sintering Die Attach Machine is a specialized semiconductor packaging machine designed to bond a semiconductor chip to a substrate or lead frame using silver sintering paste as the bonding material—instead of traditional solder.

Silver sintering is a process where nano- or micro-sized silver particles are compressed and heated to form a strong metallurgical bond between two surfaces without melting the silver. This creates a high-conductivity, high-reliability connection ideal for power electronics and high-temperature applications.

According to the new market research report “Silver Sintering Die Attach Machine - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030”, published by QYResearch, the global Silver Sintering Die Attach Machine market size is projected to reach USD 0.2 billion by 2031, at a CAGR of 6.7% during the forecast period.

Figure00001. Global Silver Sintering Die Attach Machine Market Size (US$ Million), 2020-2031

Source: QYResearch, "Silver Sintering Die Attach Machine - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030”

Figure00002. Global Silver Sintering Die Attach Machine Top 11 Players Ranking and Market Share (Ranking is based on the revenue of 2024, continually updated)

Source: QYResearch, "Silver Sintering Die Attach Machine - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030”

According to QYResearch Top Players Research Center, the global key manufacturers of Silver Sintering Die Attach Machine include Boschman, AMX Automatrix, NIKKISO, PINK GmbH Thermosysteme, Zhuhai Silicon Cool Technology, etc. In 2024, the global top five players had a share approximately 59.0% in terms of revenue.

Boschman, ASMPT, AMX Automatrix, NIKKISO and others dominate the market, and the technical barriers lie in dynamic pressure control and silver paste formulation.

Silver Sintering Die Attach Machine technology is in a rapid evolution stage. In order to meet the increasing performance requirements and diversified application scenarios of power semiconductor devices, equipment manufacturers continue to innovate in precision, efficiency, intelligence and process compatibility. From the current R&D dynamics and industrial practices, the technological development in this field shows several obvious trends, which will profoundly affect the future market competition pattern.

In terms of product type, currently Fully Automatic is the largest segment, hold a share of 89.5%.

In terms of product application, currently Power Semiconductor Device is the largest segment, hold a share of 74.4%.

As a key equipment in the field of semiconductor packaging, the global market development trend of Silver Sintering Die Attach Machine is driven by the growing demand for high-power electronic devices, the development of new energy vehicles and 5G communication technology.

During the survey period, the rise of Chinese manufacturers such as Zhuhai Silicon Cool Technology, Shenzhen Advanced Joining, Quick Intelligent Equipment, Chenglian Kaida Technology, etc., are accelerating technological catch-up, especially in cost optimization. Geopolitical factors have prompted countries to strengthen the autonomy of semiconductor equipment, and Chinese manufacturers are expected to expand their share with policy support.

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