Europe Semiconductor Bonding Market Analysis, Size, Share and Key Segments 2028

The Europe semiconductor bonding market is expected to grow from US$ 215.77 million in 2022 to US$ 349.17 million by 2028. It is estimated to grow at a CAGR of 8.4% from 2022 to 2028.

Rising Adoption of Stacked Die Technology in IoT Devices

• The adoption of stacked die technology is rising in IoT and mobile devices due to OEMs needing enhanced capabilities and performance in smaller PCBs.


• Stacked die involves placing one chip on top of another or a spacer, allowing for more functionalities in a small die placement area and preserving valuable PCB space.


• Limited workspace in PCB assembly and manufacturing for rigid and rigid-flex circuits is driving the demand for stacked die technology in IoT devices.


• Stacked die technology significantly enhances semiconductor design processes and helps produce small-sized final designs, crucial for handheld electronic devices and live tracking IoT gadgets.


• The advancement of stacked die techniques is driven by the need for smaller handheld electronic devices.


• Using stacked die reduces design effort, increases the likelihood of first-time success, and shortens time to market.


• The increasing adoption of stacked die technology in IoT devices is raising the demand for semiconductor bonding solutions, which will contribute to the growth of the Europe semiconductor
  bonding market.


• OEMs in the semiconductor sector are leveraging IoT beyond connectivity in devices like sensors, RFID tags, smart beacons, smart meters, and distribution control systems.


• These IoT devices and technologies are increasingly used in building and home automation, connected logistics, smart manufacturing, smart retail, smart mobility, and smart transportation.


• In IoT devices, semiconductor bonding techniques are used to compactly attach stacked dies to substrates, which will lead to the growth of the Europe semiconductor bonding market.


• The increasing use of semiconductor bonding techniques for stacked dies in IoT applications is a key factor in the projected expansion of the Europe semiconductor bonding market.


• Therefore, the rising adoption of stacked die technology in IoT devices is a significant driver for the growth of the Europe semiconductor bonding market.

Request sample:

https://www.businessmarketinsights.com/sample/BMIRE00027611

Europe Semiconductor Bonding Market Segmentation

The Europe semiconductor bonding market is segmented into type, application, and country.

• Based on type, the market is segmented into die bonder, wafer bonder, and flip chip bonder. The wafer bonder segment registered the largest market share in 2022.


• Based on application, the market is segmented into RF devices, MEMS and sensors, LED, CMOS image sensors, and 3D NAND. The MEMS and sensors segment held a largest market share in 2022.


• Based on country, the market is segmented into Germany, France, Italy, Russia, the UK, and rest of Europe. Germany dominated the market share in 2022.

ASMPT; DIAS Automation (HK) Ltd.; EV Group; HUTEM; Kulicke & Soffa Industries, Inc.; Palomar Technologies; Panasonic Corporation; Toray Industries Inc; WestBond, Inc.; and Yamaha Motor Corporation are the leading companies operating in the semiconductor bonding market in the Europe region.

Segments Covered    

Europe Semiconductor Bonding Market: By Type

Die Bonder

Wafer
Bonder

Flip Chip
Bonder

Europe Semiconductor Bonding Market: By Application

RF Devices

MEMS and Sensors

LED

CMOS Image
Sensors

3D NAND

About Us:

Business Market Insights is a market research platform that provides subscription service for industry and company reports. Our research team has extensive professional expertise in domains such as Electronics & Semiconductor; Aerospace & Defense; Automotive & Transportation; Energy & Power; Healthcare; Manufacturing & Construction; Food & Beverages; Chemicals & Materials; and Technology, Media, & Telecommunications