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IC Package Heat Spreaders Analysis Report ：the market size is projected to reach USD 1.25 billion by 2031
A heat spreader is high thermal conductive metallic materials for efficient heat dissipation from an IC chip in a semiconductor package.
This report studies the Heat Spreaders for semiconductor IC package, include FC (Flip Chip) heat spreaders and BGA heat spreaders. The Flip Chip heat spreaders include Lid/Ring type, Hat type, Flat Top type and Cavity type heat spreaders, etc. These spreaders are used in CPU packages for personal computers, CPU packages for servers, SoC/FPGA packages for automotive devices, Processor packages for communication equipment, and AI processor packages, etc.
Heat spreaders are one of the fundamental heat dissipation components used in various industries. They are typically made of high thermal conductivity metals such as copper or aluminum. In the electronics industry, heat spreaders or heat sinks are installed on electronic components or chips to transfer or dissipate the heat generated by the components using the thermal conductivity of the heat dissipation material itself. Heat spreaders find wide applications in the electronic information industry, semiconductor industry, and optoelectronic component industry, with downstream applications extending to the 3C industry.
Furthermore, electric vehicles (EVs) and hybrid electric vehicles (HEVs) have become a major trend in automotive development. In the inverters and rectifiers of electric vehicles, high-power chip modules pose thermal dissipation challenges. Currently, the mainstream solution for such designs is to use water-cooled heat spreaders. By utilizing highly thermally conductive metal materials, along with metal processing techniques and surface treatments, the chip temperature can be controlled within an acceptable range using water cooling. The thermal design of water-cooled heat spreaders needs to effectively dissipate the heat generated by the chips, while considering the cost and manufacturability aspects of the design for mass production.
According to the new market research report “"IC Package Heat Spreaders - Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031”, published by QYResearch, the global IC Package Heat Spreaders market size is projected to reach USD 1.25 billion by 2031, at a CAGR of 8.9% during the forecast period.
In terms of heat spreaders size, in past few years, the large size (35*35mm and Above) heat spreaders grew faster, the share will be 66.8% in 2031, from 51.15% in 2024.
In terms of materials, in 2024 the copper heat spreaders are domiating the market, hold 86.14% and in next six years, the stainless steel heat spreaders will grow faster.
In terms of application, in past few years, PC CPU/GPU is the largest application, hold 52.07% in 2024, while Server/Data Center are growing faster.
The future trends in technology will focus on personalized lifestyles, environmental sustainability, aging societies, and human-machine interface. As computer functions become more diverse, computation becomes more complex and faster, and new packaging processes emerge, the demand for heat spreaders with excellent heat dissipation capabilities will increase.
Heat spreaders are fundamental in thermal management in electronic design. In cases where natural convection is insufficient for timely heat dissipation, and forced convection using fans is not yet necessary, heat spreaders are widely used as a solution.
With the advancement of performance and miniaturization processes, the number of transistors in relation to the chip area has increased. This complexity in circuit design does not always result in a 100% improvement in performance. As a result, a significant portion of electrical energy is converted into thermal energy. Additionally, as process miniaturization progresses, leakage power consumption increases, leading to higher power requirements and waste heat generation within the same unit area. Furthermore, with the trend towards compact desktop computers and all-in-one functionality, future mini PCs will need to handle multiple tasks such as information processing and multimedia performance simultaneously. Therefore, effective heat dissipation becomes crucial, making heat spreaders an indispensable solution for efficient thermal management.
Major thermal solution providers are actively exploring new market applications, including gaming consoles, communication devices, servers, automotive electronics, home electronics, and smartphones. The emerging trends of cloud services and the Internet of Things (IoT) in the market contribute to the increasing demand for servers and data centers. As a result, the need for effective heat dissipation in central processing units (CPUs) and connectors becomes more prominent and represents a promising area for further exploration.
Figure00001. Global IC Package Heat Spreaders Market Size (US$ Million), 2020-2031
Source: QYResearch, "IC Package Heat Spreaders - Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031”
Figure00002. Global IC Package Heat Spreaders Top 11 Players Ranking and Market Share (Ranking is based on the revenue of 2024, continually updated)
Source: QYResearch, "IC Package Heat Spreaders - Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031”
Global key IC Package Heat Spreaders players cover Shinko, Honeywell Advanced Materials, Jentech Precision Industrial, I-Chiun, Favor Precision Technology and Shandong Ruisi Precision Industry etc. In terms of revenue, the global three largest companies occupied for a share nearly 85% in 2024.
About QYResearch
QYResearch founded in California, USA in 2007. It is a leading global market research and consulting company. With over 17 years’ experience and professional research team in various cities over the world QY Research focuses on management consulting, database and seminar services, IPO consulting, industry chain research and customized research to help our clients in providing non-linear revenue model and make them successful. We are globally recognized for our expansive portfolio of services, good corporate citizenship, and our strong commitment to sustainability. Up to now, we have cooperated with more than 60,000 clients across five continents. Let’s work closely with you and build a bold and better future.
QYResearch is a world-renowned large-scale consulting company. The industry covers various high-tech industry chain market segments, spanning the semiconductor industry chain (semiconductor equipment and parts, semiconductor materials, ICs, Foundry, packaging and testing, discrete devices, sensors, optoelectronic devices), photovoltaic industry chain (equipment, cells, modules, auxiliary material brackets, inverters, power station terminals), new energy automobile industry chain (batteries and materials, auto parts, batteries, motors, electronic control, automotive semiconductors, etc.), communication industry chain (communication system equipment, terminal equipment, electronic components, RF front-end, optical modules, 4G/5G/6G, broadband, IoT, digital economy, AI), advanced materials industry Chain (metal materials, polymer materials, ceramic materials, nano materials, etc.), machinery manufacturing industry chain (CNC machine tools, construction machinery, electrical machinery, 3C automation, industrial robots, lasers, industrial control, drones), food, beverages and pharmaceuticals, medical equipment, agriculture, etc.
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