SiC Polishing Consumables Market Research:the global market size is projected to reach USD 0.37 billion by 2031
Silicon Carbide (SiC) is a wide band gap semiconductor that can operate at higher temperature, power level, and voltage. This enables improved energy efficiency in power devices, LED lighting, and telecommunications. Because of its unique properties, SiC is the material of choice for diverse applications such as Hybrid Electric vehicles, power electronic switches, and LED lighting technology.
This report studies the SiC Polishing Consumables, including the SiC CMP slurry and SiC CMP pads.
The typical products of SiC CMP slurry include Entegris (Sinmat)’s SiC CMP slurry, Saint-Gobain’s ClasSiC 807 and ClasSiC 102V slurry, Fujimi’s COMPOL and DSC series slurry, etc.
According to the new market research report “SiC Polishing Consumables - Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031”, published by QYResearch, the global SiC Polishing Consumables market size is projected to reach USD 0.37 billion by 2031, at a CAGR of 14.9% during the forecast period.
Figure00001. Global SiC Polishing Consumables Market Size (US$ Million), 2020-2031
Source: QYResearch, "SiC Polishing Consumables - Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031”
Figure00002. Global SiC Polishing Consumables Top 12 Players Ranking and Market Share (Ranking is based on the revenue of 2024, continually updated)
Source: QYResearch, "SiC Polishing Consumables - Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031”
According to QYResearch, the global key manufacturers of SiC Polishing Consumables include DuPont, Entegris, Fujimi Corporation, Saint-Gobain, etc. In 2024, the global top four players had a share approximately 83.0% in terms of revenue.
About The Authors
Junping Yang - Lead Author | |
Email: yangjunping@qyresearch.com | |
Junping Yang is a technology & market senior analyst specializing in semiconductor supply chain, like IC design (Fabless/IDM), wafer fabrication (Pure play foundries/IDM), IC Packaging/Testing (IDM/OSAT), semiconductor materials (Wafer Fab Materials and Packaging Materials), and semiconductor equipment and parts. Yang has 11 years’ experience in semiconductor and focuses semiconductor equipment/parts, materials (silicon wafer, photoresist, CMP, silicon electrodes and rings), ICs, discrete devices, sensors/MEMS, RF, package & testing, etc. Typical studies include ICs, power semiconductor (IGBT, SiC, diode, MOSFET, modules and discrete), compound semiconductor (SiC, GaN, etc.), RF, optoelectronics, ceramic substrates (HTCC, LTCC, DBC, AMB, DPC, DBA), equipment & parts (wafer transfer robot, EFEM/Sorter, heaters, chiller, etc.), Lithography Systems, semiconductor refurbished/used equipment and parts, semiconductor chamber cleaning/coating, semiconductor equipment parts (ceramics, metal, plastic), Lasers, Electronic Ceramics, etc. He is engaged in the development of technology and market reports and is also involved in custom projects. |
About QYResearch
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